Suppose an n-type wafer is created by doping Si crystal having 5×1028 atoms/m3 with 1 ppm concentration of As. On the surface, 200 ppm boron is added to create 'P' region in this wafer. Considering ni=1.5×1016 m-3

(i) Calculate the densities of the charge carriers in the n & p regions.

(ii) Comment which charge carriers would contribute largely for the reverse saturation current when the diode is reverse biased.

Hint: Use nenh=ni2.
Step 1: Find the no. of majority and minority charge carriers in the n-type wafer.
When As is implanted in Si crystal, the n-type wafer is created. The number of majority carriers (electrons) due to doping of As is,
ne=ND=1106×5×1028
=5×1022 /m3
The number of minority carriers (holes) in the n-type wafer is:
nh=ni2ne=1.5×101625×1022=0.45×1010 /m3
Step 2: Find the no. of majority and minority charge carriers in the p-type wafer.
When B is implanted in Si crystal, the p-type wafer is created with the number of holes,
nh=NA=200106×(5×1028)=1×1025 /m3
Minority carriers (electrons) created in p-type wafers is
ne=ni2nh=1.5×101621×1025=2.25×1027 /m3
Step 3: Find the type of charge carriers contributing more to the reverse saturation current.
When the p-n junction is reverse biased, the minority carrier holes of the n-region wafer (nh=0.45×1010 /m3) would contribute more to the reverse saturation current than minority carrier electrons (ne=2.25×107 /m3) of the p-region wafer.